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Highly reactive liquid epoxy resin with excellent compatibility with standard amine and anhydride curing agents.
Low viscosity (3,000–4,500 cP at 25°C) enabling easy processing, impregnation, and air-release during casting or lamination.
Superior electrical insulation properties with high dielectric strength and low dissipation factor.
Excellent thermal stability and chemical resistance, particularly to alkalis and polar solvents.
Low chloride content (< 800 ppm), ensuring reliable performance in sensitive electronic encapsulation applications.
Electrical and electronic encapsulation for transformers, reactors, and high-voltage insulators.
Castings for busbar supports, switchgear components, and GIS (Gas-Insulated Switchgear) parts.
Structural adhesives requiring high bond strength and thermal resilience in automotive and rail applications.
Matrix resin for fiber-reinforced composites used in energy infrastructure and industrial tooling.
Underfill and potting formulations for power electronics modules and IGBT packaging.
| Chemical Type | Diglycidyl ether of bisphenol-A (DGEBA) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Colorless to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 3,000–4,500 cP |
| Chloride Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | ≥ 12 months at 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
