High reactivity with amine and anhydride hardeners for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and fiber-reinforced substrates.
Low viscosity (8,000–12,000 cP at 25°C) enabling easy processing, impregnation, and air release.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good thermal stability and chemical resistance after full cure, suitable for demanding service environments.
Electrical encapsulation and potting of transformers, reactors, and high-voltage components.
Matrix resin for filament-wound pressure vessels and structural composite parts.
Insulating coatings and busbar encapsulants in power distribution equipment.
Laminating resin for high-performance printed circuit board (PCB) prepregs and core materials.
Adhesive formulations for bonding dissimilar substrates in aerospace and rail transportation systems.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Pale yellow to water-white, transparent |
| Epoxy Equivalent Weight (EEW) | 176–184 g/eq |
| Viscosity (25°C) | 9,500–11,500 cP |
| Chloride Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Electrical insulation, structural composites, and high-performance adhesives |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China