Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KUKDO SMB-530EK-80 Epoxy Resin

KUKDO SMB-530EK-80 Epoxy Resin is a high-performance, low-viscosity liquid epoxy resin designed for electrical encapsulation and LED packaging. Featuring excellent thermal stability, moisture resistance, and optical clarity, it ensures reliable insulation and long-term durability. Ideal for demanding industrial applications requiring precision curing and superior adhesion.
  • kukdo smb 530ek 80 epoxy resin_164cec5d
  • kukdo smb 530ek 80 epoxy resin_164cec5d

Features Of KUKDO SMB-530EK-80 Epoxy Resin

  1. High reactivity with amine and anhydride hardeners for rapid gelation and short cycle times.

  2. Excellent adhesion to metals, composites, and fiber-reinforced substrates.

  3. Low viscosity (8,000–12,000 cP at 25°C) enabling easy processing, impregnation, and air release.

  4. Superior electrical insulation properties with high dielectric strength and volume resistivity.

  5. Good thermal stability and chemical resistance after full cure, suitable for demanding service environments.

Typical Applications Of KUKDO SMB-530EK-80 Epoxy Resin

  1. Electrical encapsulation and potting of transformers, reactors, and high-voltage components.

  2. Matrix resin for filament-wound pressure vessels and structural composite parts.

  3. Insulating coatings and busbar encapsulants in power distribution equipment.

  4. Laminating resin for high-performance printed circuit board (PCB) prepregs and core materials.

  5. Adhesive formulations for bonding dissimilar substrates in aerospace and rail transportation systems.

Specifications Of KUKDO SMB-530EK-80 Epoxy Resin

Chemical TypeBisphenol-F based liquid epoxy resin
Product FormClear, low-viscosity liquid
AppearancePale yellow to water-white, transparent
Epoxy Equivalent Weight (EEW)176–184 g/eq
Viscosity (25°C)9,500–11,500 cP
Chloride Content≤ 800 ppm
Softening PointNot applicable (liquid at room temperature)
Primary ApplicationsElectrical insulation, structural composites, and high-performance adhesives


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