High purity Bisphenol A-based epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low ionic impurity content for enhanced electrical insulation performance.
Optimized viscosity for efficient processing in solvent-free and high-solids coating systems.
Superior adhesion to metals, composites, and cured epoxy substrates.
Reactive functionality tailored for compatibility with standard amine and anhydride curing agents.
Electrical laminates for printed circuit boards (PCBs) and insulating layers.
High-performance protective coatings for industrial steel structures and marine equipment.
Structural adhesives in aerospace and automotive composite bonding.
Encapsulation resins for power electronics and LED modules.
Matrix resin for fiber-reinforced polymer (FRP) tanks and piping systems.
| Chemical Type | Bisphenol A diglycidyl ether (DGEBA) epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free of gels or suspended particles |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–16,000 mPa·s |
| Chlorine Content | ≤ 900 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | High-reliability electrical insulation, structural composites, corrosion-resistant coatings |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China