High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured polymer substrates.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing, impregnation, and air release.
Good thermal stability with glass transition temperature (Tg) up to 125°C after full cure.
Low chloride content (< 800 ppm), ensuring high electrical insulation performance and corrosion resistance.
Electrical encapsulation and potting of transformers, reactors, and power electronics.
Structural adhesive formulations for aerospace and automotive composite bonding.
Matrix resin for filament-wound pressure vessels and FRP tanks.
High-performance laminating resin in printed circuit board (PCB) prepregs and base materials.
Tooling and mold-making compounds requiring dimensional stability and low shrinkage.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gel particles or sediment |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chlorine Content | < 800 ppm |
| Softening Point | 12–16°C |
| Storage Stability (25°C) | ≥ 12 months in sealed container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China