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High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and engineered plastics under demanding thermal and mechanical conditions.
Low viscosity (450–650 mPa·s at 25°C) enabling easy processing, impregnation, and void-free casting.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Enhanced thermal stability with glass transition temperature (Tg) exceeding 180°C after full cure.
High-voltage insulators and bushings for power transmission equipment.
Encapsulation and potting of aerospace-grade electronic modules and sensors.
Structural adhesives in automotive electric drive systems and battery module bonding.
Matrix resin for carbon fiber reinforced laminates used in wind turbine blade root joints.
Die-casting mold tooling and precision fixture fabrication requiring dimensional stability.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to pale yellow low-viscosity liquid |
| Appearance | Homogeneous, transparent, free from gels or suspended particles |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity (25°C) | 450–650 mPa·s |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤ 25°C in sealed original containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
