Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

CCP FUJICURE FXR-1020 Epoxy Resin

CCP FUJICURE FXR-1020 Epoxy Resin is a low-viscosity, fast-curing brominated epoxy resin from CCP’s FUJICURE series—designed for high-Tg encapsulation, LED molding, and precision electronic potting. It offers excellent flame retardancy (UL94 V-0), thermal stability, and adhesion to metals/ceramics without requiring post-cure.
  • ccp fujicure fxr 1020 epoxy resin_c006134f
  • ccp fujicure fxr 1020 epoxy resin_c006134f

Features Of CCP FUJICURE FXR-1020 Epoxy Resin

  1. High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.

  2. Excellent adhesion to metals, composites, and engineered plastics under demanding thermal and mechanical conditions.

  3. Low viscosity (450–650 mPa·s at 25°C) enabling easy processing, impregnation, and void-free casting.

  4. Superior electrical insulation properties with high dielectric strength and volume resistivity.

  5. Enhanced thermal stability with glass transition temperature (Tg) exceeding 180°C after full cure.

Typical Applications Of CCP FUJICURE FXR-1020 Epoxy Resin

  1. High-voltage insulators and bushings for power transmission equipment.

  2. Encapsulation and potting of aerospace-grade electronic modules and sensors.

  3. Structural adhesives in automotive electric drive systems and battery module bonding.

  4. Matrix resin for carbon fiber reinforced laminates used in wind turbine blade root joints.

  5. Die-casting mold tooling and precision fixture fabrication requiring dimensional stability.

Specifications Of CCP FUJICURE FXR-1020 Epoxy Resin

Chemical TypeBisphenol-F based liquid epoxy resin
Product FormClear to pale yellow low-viscosity liquid
AppearanceHomogeneous, transparent, free from gels or suspended particles
Epoxy Equivalent Weight (EEW)175–185 g/eq
Viscosity (25°C)450–650 mPa·s
Chloride Content≤ 500 ppm
Softening PointNot applicable (liquid at room temperature)
Storage Stability12 months at ≤ 25°C in sealed original containers


CCP FUJICURE FXR-1020 Epoxy Resin – Frequently Asked Questions (FAQ)

Q1: What is the primary functional role of FXR-1020 in epoxy formulations?

A: FXR-1020 is a reactive diluent designed to reduce viscosity and improve processability of epoxy resins without significantly compromising crosslink density or thermal performance. It participates directly in the curing reaction as a co-monomer.


Q2: Is FXR-1020 compatible with common amine and anhydride curing agents?

A: Yes — FXR-1020 demonstrates broad compatibility with aliphatic and aromatic amines, as well as cyclic anhydrides. Its reactivity profile allows for flexible formulation design across ambient-cure and elevated-temperature cure systems.


Q3: How does FXR-1020 affect the final cured film properties compared to non-reactive diluents?

A: Unlike non-reactive diluents, FXR-1020 becomes part of the polymer network, helping retain mechanical strength, chemical resistance, and glass transition temperature (Tg) — especially when used at typical dosage levels.


Q4: What handling precautions should be observed during storage and processing?

A: Store in tightly sealed containers under dry, cool conditions away from moisture and strong oxidizers. As with most epoxy intermediates, standard industrial hygiene practices apply — use appropriate PPE (gloves, eye protection) and ensure adequate ventilation during handling.



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