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Low-viscosity liquid epoxy resin suitable for ambient or mild-heat curing systems.
Excellent adhesion to metals, glass, and composite substrates.
Good chemical resistance to dilute acids, alkalis, and polar solvents.
High purity with low chloride ion content (< 500 ppm), ensuring reliability in electronic encapsulation.
Compatible with standard amine, anhydride, and catalytic hardeners for flexible formulation design.
Electrical insulation and potting compounds for transformers and sensors.
Structural adhesives for aerospace and automotive bonding applications.
Composite matrix resin for carbon fiber and fiberglass laminates.
Coating binders for corrosion-resistant industrial floor and tank linings.
Encapsulants for LED modules and power electronics packaging.
| Chemical Type | Bisphenol-A based diglycidyl ether epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Colorless to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 184–190 g/eq |
| Viscosity at 25°C | 12,000–15,000 cP |
| Chloride Content | ≤ 500 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | ≥ 12 months at ≤ 25°C in sealed containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
