Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KUKDO SM604R Epoxy Resin

KUKDO SM604R Epoxy Resin is a high-performance, low-viscosity liquid epoxy from KUKDO’s SM series, designed for composites, electrical encapsulation, and adhesive applications. It offers excellent mechanical strength, thermal stability, and compatibility with standard hardeners like DICY and anhydrides. Widely used in aerospace, electronics, and wind energy sectors due to its reliable processability and superior adhesion.
  • kukdo sm604r epoxy resin_017ea733
  • kukdo sm604r epoxy resin_017ea733

Features Of KUKDO SM604R Epoxy Resin

  1. High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.

  2. Excellent adhesion to metals, composites, and cured concrete substrates.

  3. Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing, impregnation, and air release.

  4. Superior chemical resistance to alkalis, diluted acids, and solvents after full cure.

  5. Low chloride content (< 500 ppm), minimizing corrosion risk in reinforced polymer systems.

Typical Applications Of KUKDO SM604R Epoxy Resin

  1. Structural adhesive formulations for automotive and aerospace bonding.

  2. Matrix resin for filament-wound pressure vessels and composite pipes.

  3. Electrical encapsulation and potting compounds for high-voltage equipment.

  4. Repair mortars and polymer-modified grouts for industrial flooring.

  5. Wind turbine blade bonding and leading-edge protection coatings.

Specifications Of KUKDO SM604R Epoxy Resin

Chemical TypeBisphenol-A based liquid epoxy resin
Product FormClear to pale yellow viscous liquid
AppearanceHomogeneous, transparent, free of gels or sediment
Epoxy Equivalent Weight (EEW)185–195 g/eq
Viscosity (25°C)12,000–15,000 cP
Chlorine Content< 500 ppm
Softening PointNot applicable (liquid at room temperature)
Primary ApplicationsStructural adhesives, composite matrices, electrical encapsulation


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