High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured concrete substrates.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing, impregnation, and air release.
Superior chemical resistance to alkalis, diluted acids, and solvents after full cure.
Low chloride content (< 500 ppm), minimizing corrosion risk in reinforced polymer systems.
Structural adhesive formulations for automotive and aerospace bonding.
Matrix resin for filament-wound pressure vessels and composite pipes.
Electrical encapsulation and potting compounds for high-voltage equipment.
Repair mortars and polymer-modified grouts for industrial flooring.
Wind turbine blade bonding and leading-edge protection coatings.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free of gels or sediment |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chlorine Content | < 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Structural adhesives, composite matrices, electrical encapsulation |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China