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Low-viscosity liquid epoxy resin enabling excellent processability and ease of handling in casting, potting, and impregnation applications.
High purity with low chlorine content, supporting superior electrical insulation properties and long-term reliability.
Excellent compatibility with standard amine and anhydride curing agents for flexible formulation design.
Good adhesion to metals, glass, and composites—ideal for structural bonding and encapsulation.
Consistent batch-to-batch performance validated through rigorous quality control per ISO 9001 standards.
Electrical and electronic encapsulation, including transformers, reactors, and high-voltage insulators.
Potting compounds for sensors, power modules, and printed circuit board (PCB) protection.
Castings for busbars, switchgear components, and dielectric barriers in energy infrastructure.
Impregnation resins for dry-type transformer windings and rotating machine stators.
Formulation base for specialty laminating and adhesive systems requiring thermal stability and low shrinkage.
| Chemical Type | Diglycidyl ether of bisphenol-A (DGEBA) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Colorless to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity at 25°C | 12–16 Pa·s (12,000–16,000 cP) |
| Chloride Content | ≤ 700 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | ≥ 12 months at ≤ 25°C in original unopened container |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
