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Low-viscosity liquid epoxy resin enabling excellent processability and ease of handling in casting, potting, and impregnation applications.
High purity with low chlorine content, supporting superior electrical insulation properties and long-term reliability.
Excellent compatibility with standard amine and anhydride curing agents for flexible formulation design.
Good adhesion to metals, glass, and composites—ideal for structural bonding and encapsulation.
Consistent batch-to-batch performance validated through rigorous quality control per ISO 9001 standards.
Electrical and electronic encapsulation, including transformers, reactors, and high-voltage insulators.
Potting compounds for sensors, power modules, and printed circuit board (PCB) protection.
Castings for busbars, switchgear components, and dielectric barriers in energy infrastructure.
Impregnation resins for dry-type transformer windings and rotating machine stators.
Formulation base for specialty laminating and adhesive systems requiring thermal stability and low shrinkage.
| Chemical Type | Diglycidyl ether of bisphenol-A (DGEBA) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Colorless to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity at 25°C | 12–16 Pa·s (12,000–16,000 cP) |
| Chloride Content | ≤ 700 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | ≥ 12 months at ≤ 25°C in original unopened container |
Q1: What is the primary function of HELoxy 62 in epoxy formulations?
A: HELoxy 62 is a reactive diluent designed to reduce viscosity and improve processability of standard bisphenol-A or bisphenol-F epoxy resins without significantly compromising final crosslink density or thermal performance.
Q2: Is HELoxy 62 suitable for high-gloss, low-VOC coatings applications?
A: Yes — as a mono-functional reactive diluent with low volatility and no added solvents, HELoxy 62 supports formulating high-solids, low-VOC epoxy coatings while maintaining good film formation and surface aesthetics.
Q3: How does HELoxy 62 affect cure kinetics and pot life when blended with conventional epoxy resins?
A: HELoxy 62 generally extends pot life slightly due to its lower reactivity compared to the base resin, but it participates fully in the curing reaction. Cure schedules may require minor adjustment depending on hardener type and overall formulation balance.
Q4: Can HELoxy 62 be used in flexible or impact-modified epoxy systems?
A: It is compatible with many toughening agents and elastomeric modifiers, and its incorporation can help maintain workability during blending — however, excessive use may reduce overall crosslink density and modulus, so dosage should be optimized per application requirements.
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