Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KUKDO F-44 Epoxy Resin

KUKDO F-44 Epoxy Resin is a bisphenol-A based liquid epoxy resin from Kukdo’s high-performance F-series, offering excellent adhesion, chemical resistance, and mechanical strength for coatings, adhesives, and composites. It features low viscosity, good reactivity with amines/anhydrides, and superior electrical insulation properties. Widely used in marine, automotive, and electronics applications requiring durable, corrosion-resistant polymer systems.
  • kukdo f 44 epoxy resin_4b201237
  • kukdo f 44 epoxy resin_4b201237

Features Of KUKDO F-44 Epoxy Resin

  1. High epoxy equivalent weight (EEW) for enhanced flexibility and impact resistance in cured systems.

  2. Low viscosity at ambient temperature, enabling excellent processability and easy handling in casting, potting, and coating applications.

  3. Superior chemical resistance to alkalis, solvents, and mild acids after proper curing with suitable hardeners.

  4. Excellent adhesion to diverse substrates including metals, composites, and concrete.

  5. Consistent batch-to-batch quality with strict control over chloride content and gel time stability.

Typical Applications Of KUKDO F-44 Epoxy Resin

  1. Electrical insulation encapsulants for transformers, reactors, and high-voltage components.

  2. Structural adhesives requiring high toughness and thermal cycling performance.

  3. Protective coatings for marine and offshore infrastructure exposed to harsh environments.

  4. Potting compounds for electronic modules demanding low exotherm and minimal shrinkage.

  5. Matrix resin in fiber-reinforced composites for wind turbine blades and transportation parts.

Specifications Of KUKDO F-44 Epoxy Resin

Chemical TypeBisphenol-F based liquid epoxy resin
Product FormClear to pale yellow viscous liquid
AppearanceHomogeneous, transparent, free of suspended matter
Epoxy Equivalent Weight (EEW)175–190 g/eq
Viscosity at 25°C12,000–18,000 cP
Chlorine Content (Total Cl)≤ 700 ppm
Softening PointNot applicable (liquid at room temperature)
Primary ApplicationsEncapsulation, potting, high-performance coatings, structural adhesives


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