High epoxy equivalent weight (EEW) for enhanced flexibility and impact resistance in cured systems.
Low viscosity at ambient temperature, enabling excellent processability and easy handling in casting, potting, and coating applications.
Superior chemical resistance to alkalis, solvents, and mild acids after proper curing with suitable hardeners.
Excellent adhesion to diverse substrates including metals, composites, and concrete.
Consistent batch-to-batch quality with strict control over chloride content and gel time stability.
Electrical insulation encapsulants for transformers, reactors, and high-voltage components.
Structural adhesives requiring high toughness and thermal cycling performance.
Protective coatings for marine and offshore infrastructure exposed to harsh environments.
Potting compounds for electronic modules demanding low exotherm and minimal shrinkage.
Matrix resin in fiber-reinforced composites for wind turbine blades and transportation parts.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free of suspended matter |
| Epoxy Equivalent Weight (EEW) | 175–190 g/eq |
| Viscosity at 25°C | 12,000–18,000 cP |
| Chlorine Content (Total Cl) | ≤ 700 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Encapsulation, potting, high-performance coatings, structural adhesives |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China