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Highly reactive liquid epoxy resin with low viscosity for excellent processability and filler wetting.
Designed for high-gloss, low-haze cured films with superior surface aesthetics and clarity.
Offers enhanced thermal stability and improved chemical resistance compared to conventional bisphenol-A based resins.
Compatible with standard amine and anhydride curing agents, enabling flexible formulation design.
Low chloride content ensures reduced corrosion risk in metal-coated electronic and automotive applications.
High-performance protective coatings for automotive underhood components.
Electrical insulating varnishes for motors, transformers, and coil impregnation.
Powder coating formulations requiring smooth finish and rapid flow characteristics.
Electronic encapsulants and potting compounds demanding low ionic impurities.
Composite matrix resins for carbon fiber-reinforced structural parts.
| Chemical Type | Liquid bisphenol-F type epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Colorless to pale yellow transparent liquid |
| Epoxy Equivalent Weight (EEW) | 165–175 g/eq |
| Viscosity (25°C) | 8,000–12,000 mPa·s |
| Chloride Content | ≤ 300 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability (25°C) | ≥ 12 months in sealed container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
