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High reactivity with standard amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.
Excellent adhesion to metals, composites, and treated plastics without requiring primers.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing via casting, impregnation, and filament winding.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good chemical resistance to dilute acids, alkalis, and aliphatic hydrocarbons after full cure.
Electrical encapsulation of transformers, reactors, and medium-voltage insulators.
Structural bonding in wind turbine blade assembly and automotive composite components.
Matrix resin for glass-fiber reinforced laminates used in marine and industrial corrosion-resistant linings.
High-performance potting compounds for power electronics and LED lighting modules.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow low-viscosity liquid |
| Appearance | Transparent, slightly viscous liquid, free from gels or sediment |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Softening Point | Not applicable (liquid at room temperature) |
| Density (25°C) | 1.16–1.18 g/cm³ |
| Primary Applications | Encapsulation, laminating, adhesive bonding, and composite matrix |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
