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High purity bisphenol A-based epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low volatility, suitable for high-temperature curing processes.
Superior adhesion to metals, composites, and cured polymer substrates.
Low ionic chloride content (< 500 ppm), minimizing corrosion risk in electronic encapsulation.
Good solubility in common reactive diluents and aromatic solvents for formulation flexibility.
Electrical insulation systems for motors, transformers, and generators.
Structural adhesives for aerospace and automotive composite bonding.
Prepregs and laminates in printed circuit board (PCB) manufacturing.
High-performance coatings for chemical-resistant industrial tank linings.
Encapsulants and potting compounds for power electronics and LED modules.
| Chemical Type | Bisphenol A diglycidyl ether (DGEBA) epoxy resin |
| Product Form | Amber to light yellow viscous liquid |
| Appearance | Clear, transparent, free from gels or suspended particles |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–15,000 mPa·s |
| Chlorine Content (Total) | ≤ 800 ppm |
| Softening Point | 12–15°C |
| Volatiles (150°C, 2 h) | ≤ 0.3 wt% |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
