High purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with standard amine and anhydride curing agents for broad formulation flexibility.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing, mixing, and impregnation.
Superior electrical insulation properties and low dielectric loss for demanding electronic applications.
Good adhesion to metals, glass, and composites with enhanced thermal stability post-cure.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Structural adhesive formulations for aerospace and automotive bonding.
Matrix resin for fiber-reinforced composites in wind turbine blades and marine components.
Coating systems for corrosion-resistant tank linings and industrial flooring.
Potting compounds for power electronics, LED modules, and sensor protection.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, pale yellow liquid |
| Appearance | Transparent, slightly viscous liquid |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chlorine Content | ≤ 1,000 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | ≥ 12 months at ≤ 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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