High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics without requiring primers.
Low viscosity (8,000–12,000 cP at 25°C) enabling easy handling, degassing, and deep-section impregnation.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good thermal stability with glass transition temperature (Tg) up to 130°C after post-cure.
Electrical encapsulation of transformers, inductors, and high-voltage power modules.
Structural bonding and potting in automotive electronic control units (ECUs) and sensors.
Impregnation of motor windings and stator coils in industrial and traction motors.
Manufacturing of high-performance composite laminates for aerospace interior components.
Underfill and edge-fill applications in power semiconductor packaging.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear, low-viscosity amber liquid |
| Appearance | Transparent to slightly yellow, homogeneous |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 8,000–12,000 cP |
| Softening Point | Not applicable (liquid at room temperature) |
| Chloride Content | ≤ 500 ppm |
| Primary Applications | Encapsulation, potting, impregnation, laminating |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China