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Low-viscosity liquid epoxy resin ideal for easy handling and processing at ambient temperature.
Excellent compatibility with standard amine and anhydride curing agents.
Provides good adhesion to metals, composites, and cured polymer substrates.
Offers balanced mechanical properties including toughness and chemical resistance after cure.
Designed for use in reactive diluent systems to reduce formulation viscosity without significant loss of functionality.
Electrical encapsulation and potting compounds for transformers and electronic components.
High-performance adhesive formulations for aerospace and automotive bonding.
Composite matrix resins for filament-wound pressure vessels and structural laminates.
Coating systems requiring low shrinkage and excellent substrate wetting.
Reactive diluent in high-solids or solvent-free epoxy coatings and flooring systems.
| Chemical Type | Diglycidyl ether of bisphenol-A (DGEBA) derivative |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Colorless to pale yellow, transparent liquid |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity at 25°C | 10–14 Pa·s (10,000–14,000 cP) |
| Chloride Content | < 1,000 ppm |
| Primary Applications | Reactive diluent, adhesive component, composite matrix modifier |
| Key Features | Low volatility, low skin sensitization potential, good hydrolytic stability |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
