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High-purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with standard amine and anhydride curing agents for broad formulation flexibility.
Low viscosity (10,000–12,000 cP at 25°C) enabling easy handling, mixing, and impregnation of fibers or fillers.
Superior electrical insulation properties and high dielectric strength suitable for electronic encapsulation.
Good thermal stability and adhesion to metals, glass, and composite substrates after curing.
Electrical insulation coatings and potting compounds for transformers and circuit breakers.
Structural adhesives in automotive and aerospace composite bonding applications.
Matrix resin for filament-wound pressure vessels and FRP pipes.
Prepreg systems for high-performance printed circuit board (PCB) laminates.
Castings and encapsulants for high-voltage sensors and power electronics modules.
| Chemical Type | Bisphenol-A Diglycidyl Ether (DGEBA) |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Transparent, homogeneous, free from gel particles or sediment |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | 12–16°C |
| Primary Applications | Electrical insulation, structural composites, adhesive formulations |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
