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High-purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with standard amine and anhydride curing agents for broad formulation flexibility.
Low viscosity (10,000–12,000 cP at 25°C) enabling easy handling, mixing, and impregnation of fibers or fillers.
Superior electrical insulation properties and high dielectric strength suitable for electronic encapsulation.
Good thermal stability and adhesion to metals, glass, and composite substrates after curing.
Electrical insulation coatings and potting compounds for transformers and circuit breakers.
Structural adhesives in automotive and aerospace composite bonding applications.
Matrix resin for filament-wound pressure vessels and FRP pipes.
Prepreg systems for high-performance printed circuit board (PCB) laminates.
Castings and encapsulants for high-voltage sensors and power electronics modules.
| Chemical Type | Bisphenol-A Diglycidyl Ether (DGEBA) |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Transparent, homogeneous, free from gel particles or sediment |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | 12–16°C |
| Primary Applications | Electrical insulation, structural composites, adhesive formulations |
Q1: What is the primary application of KUKDO YD-115G epoxy resin?
A: KUKDO YD-115G is a liquid bisphenol-A based epoxy resin primarily used as a reactive diluent and viscosity modifier in high-performance coating, adhesive, and composite formulations—especially where improved flow, reduced shrinkage, and enhanced crosslink density are required.
Q2: How does YD-115G differ from standard DGEBA resins like YD-128 or YD-138?
A: Unlike conventional solid or higher-viscosity DGEBA resins, YD-115G features lower molecular weight and significantly reduced viscosity, enabling easier handling and better compatibility with fillers and toughening agents without requiring elevated temperatures or strong solvents.
Q3: Is YD-115G suitable for UV-curable systems?
A: No—YD-115G is a thermally curable epoxy resin and lacks the acrylate functionality required for free-radical UV polymerization. It is designed for use with amine, anhydride, or phenolic hardeners under thermal conditions.
Q4: What storage conditions are recommended for long-term stability?
A: Store in tightly sealed original containers at temperatures between 10–30°C, away from direct sunlight and moisture. Prolonged exposure to humidity or temperatures above 40°C may lead to premature crystallization or viscosity increase.
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