High reactivity with amine and anhydride hardeners for rapid gelation and short cure cycles.
Excellent adhesion to metals, composites, and cured epoxy substrates without surface priming.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing, impregnation, and bubble-free casting.
Superior thermal stability with glass transition temperature (Tg) up to 125°C after full cure.
Low chloride content (< 500 ppm), ensuring high electrical insulation performance and corrosion resistance.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Structural adhesive formulation for aerospace composite bonding and metal-to-composite joints.
Matrix resin for filament-wound pressure vessels and carbon fiber reinforced pipes.
Casting compound for precision industrial tooling, jigs, and die blocks requiring dimensional stability.
Underfill material in power electronics modules demanding low stress and high thermal cycling reliability.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear, amber-colored liquid |
| Appearance | Homogeneous, transparent, free from gels or sediment |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | < 500 ppm |
| Softening Point | 12–16°C |
| Storage Stability | 12 months at < 25°C in sealed original container |
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E-mail: wangxingqiang@ericwchem.com
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