Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KUKDO SM-678 Epoxy Resin

KUKDO SM-678 Epoxy Resin is a high-performance liquid bisphenol-A epoxy resin from KUKDO’s SM series, offering excellent adhesion, chemical resistance and mechanical strength. Widely used in composites, coatings and electrical encapsulation, it features low viscosity, good reactivity with amines/anhydrides and consistent batch-to-batch quality. Ideal for demanding industrial applications requiring reliability and process efficiency.
  • kukdo sm 678 epoxy resin_135f06f6
  • kukdo sm 678 epoxy resin_135f06f6

Features Of KUKDO SM-678 Epoxy Resin

  1. High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.

  2. Excellent adhesion to metals, composites, and treated plastics without primer requirement.

  3. Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing, impregnation, and air release.

  4. Superior thermal stability with glass transition temperature (Tg) up to 185°C post-cure.

  5. Low chloride ion content (<150 ppm), ensuring compatibility with sensitive electronic encapsulation.

Typical Applications Of KUKDO SM-678 Epoxy Resin

  1. Electrical insulation and potting of power electronics and IGBT modules.

  2. Structural adhesive formulations for aerospace composite bonding.

  3. High-performance wind turbine blade root joints and shear web bonding.

  4. Encapsulation of high-voltage sensors and automotive EV battery components.

  5. Prepreg matrix resin for carbon fiber laminates requiring elevated Tg and toughness.

Specifications Of KUKDO SM-678 Epoxy Resin

Chemical TypeBisphenol-F based liquid epoxy resin
Product FormClear, low-viscosity liquid
AppearancePale yellow to water-white, transparent
Epoxy Equivalent Weight (EEW)178–184 g/eq
Viscosity (25°C)12,000–14,000 cP
Chloride Content<150 ppm
Softening PointNot applicable (liquid at room temperature)
Storage Stability12 months at ≤25°C in sealed original container


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