High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics without primer requirement.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing, impregnation, and air release.
Superior thermal stability with glass transition temperature (Tg) up to 185°C post-cure.
Low chloride ion content (<150 ppm), ensuring compatibility with sensitive electronic encapsulation.
Electrical insulation and potting of power electronics and IGBT modules.
Structural adhesive formulations for aerospace composite bonding.
High-performance wind turbine blade root joints and shear web bonding.
Encapsulation of high-voltage sensors and automotive EV battery components.
Prepreg matrix resin for carbon fiber laminates requiring elevated Tg and toughness.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Pale yellow to water-white, transparent |
| Epoxy Equivalent Weight (EEW) | 178–184 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | <150 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤25°C in sealed original container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China