High purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low volatility, suitable for high-temperature processing environments.
Superior adhesion to metals, glass fibers, and carbon substrates without requiring additional primers.
Low chlorine content (< 750 ppm), minimizing corrosion risk in electronic encapsulation applications.
Optimized viscosity (10,000–12,000 cP at 25°C) for precise dispensing and uniform film formation.
Encapsulation and potting of power electronics and LED modules.
Matrix resin for high-performance carbon fiber reinforced composites in aerospace components.
Electrical insulation coatings for busbars, transformers, and high-voltage connectors.
Structural adhesive formulations requiring elevated Tg and long-term chemical resistance.
Prepreg systems for printed circuit board (PCB) laminates and multilayer interconnects.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, amber-colored liquid |
| Appearance | Homogeneous, transparent, free from gel particles or sediment |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chlorine Content | ≤ 750 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | ≥ 12 months at ≤ 30°C in sealed original containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China