High purity bisphenol-A based liquid epoxy resin with low chlorine content.
Excellent thermal stability and low viscosity for enhanced processability.
Superior adhesion to metals, glass, and composite substrates.
Consistent reactivity profile suitable for controlled curing with standard amine or anhydride hardeners.
Low volatile organic compound (VOC) emission, compliant with industrial environmental guidelines.
Electrical encapsulation and potting of transformers, reactors, and insulators.
Structural adhesives for aerospace and automotive bonding applications.
Matrix resin for fiber-reinforced composites in wind turbine blades and marine components.
Coating formulations for corrosion-resistant tank linings and pipe coatings.
Prepregs and laminates in printed circuit board (PCB) manufacturing.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, amber-colored liquid |
| Appearance | Homogeneous, low-viscosity liquid at 25°C |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Chlorine Content | ≤ 800 ppm |
| Viscosity (25°C) | 12,000–16,000 cP |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Encapsulation, composites, adhesives, protective coatings |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China