Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KUKDO YD-011MS65S Epoxy Resin

KUKDO YD-011MS65S Epoxy Resin is a high-performance, low-viscosity bisphenol-A based epoxy resin from KUKDO’s YD series. Designed for composites, electrical encapsulation and advanced laminates, it offers excellent adhesion, thermal stability and mechanical strength. Its optimized molecular weight ensures superior processability and curing reactivity with amines or anhydrides. Widely used in aerospace, wind energy and PCB applications.
  • kukdo yd 011ms65s epoxy resin_b7add3d0
  • kukdo yd 011ms65s epoxy resin_b7add3d0

Features Of KUKDO YD-011MS65S Epoxy Resin

  1. High-purity bisphenol-A based epoxy resin with low chlorine content for enhanced electrical insulation performance.

  2. Optimized molecular weight distribution ensuring excellent flow control and reduced viscosity during processing.

  3. Superior thermal stability with glass transition temperature (Tg) suitable for medium-temperature curing systems.

  4. Low volatility and minimal volatile organic compound (VOC) emission, supporting safer handling and regulatory compliance.

  5. Consistent batch-to-batch reproducibility meeting strict quality control standards for industrial-scale production.

Typical Applications Of KUKDO YD-011MS65S Epoxy Resin

  1. Electrical encapsulation of transformers, reactors, and high-voltage insulators.

  2. Structural adhesives for aerospace composite bonding and automotive lightweight assemblies.

  3. Prepreg matrix resin for carbon fiber reinforced polymer (CFRP) laminates.

  4. Coating formulations for corrosion-resistant linings in chemical storage tanks and piping systems.

  5. Dielectric potting compounds for electronic modules requiring long-term thermal and moisture resistance.

Specifications Of KUKDO YD-011MS65S Epoxy Resin

Chemical TypeBisphenol-A epoxy resin
Product FormAmber to light yellow viscous liquid
AppearanceClear, transparent, free from gel particles or sediment
Epoxy Equivalent Weight (EEW)185–195 g/eq
Viscosity (25°C)12,000–16,000 cP
Chlorine Content≤ 800 ppm
Softening Point10–14°C
Primary ApplicationsEncapsulation, composites, adhesives, and protective coatings


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