High-purity bisphenol-A based epoxy resin with low chlorine content for enhanced electrical insulation performance.
Optimized molecular weight distribution ensuring excellent flow control and reduced viscosity during processing.
Superior thermal stability with glass transition temperature (Tg) suitable for medium-temperature curing systems.
Low volatility and minimal volatile organic compound (VOC) emission, supporting safer handling and regulatory compliance.
Consistent batch-to-batch reproducibility meeting strict quality control standards for industrial-scale production.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Structural adhesives for aerospace composite bonding and automotive lightweight assemblies.
Prepreg matrix resin for carbon fiber reinforced polymer (CFRP) laminates.
Coating formulations for corrosion-resistant linings in chemical storage tanks and piping systems.
Dielectric potting compounds for electronic modules requiring long-term thermal and moisture resistance.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Amber to light yellow viscous liquid |
| Appearance | Clear, transparent, free from gel particles or sediment |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 12,000–16,000 cP |
| Chlorine Content | ≤ 800 ppm |
| Softening Point | 10–14°C |
| Primary Applications | Encapsulation, composites, adhesives, and protective coatings |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China