High-purity bisphenol-A based liquid epoxy resin with low chloride content.
Excellent compatibility with standard amine and anhydride curing agents.
Low viscosity for improved processability in casting, potting, and laminating applications.
Good thermal stability and mechanical strength after full cure.
Consistent batch-to-batch performance meeting ISO 9001 manufacturing controls.
Electrical insulation systems for transformers and reactors.
Potting and encapsulation of electronic components and sensors.
Structural adhesives for aerospace and automotive composites.
Prepreg and laminated board manufacturing in printed circuit board (PCB) industry.
High-performance coatings for corrosion protection in industrial equipment.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Colorless to pale yellow transparent liquid |
| Epoxy Equivalent Weight (EEW) | 184–190 g/eq |
| Viscosity at 25°C | 12,000–14,000 cP |
| Chlorine Content | ≤ 700 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | ≥ 12 months at 20–25°C in sealed container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China