High-purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with common amine and anhydride curing agents for broad formulation flexibility.
Low viscosity (10,000–12,000 cP at 25°C) enabling easy handling, mixing, and impregnation in processing.
Superior electrical insulation properties and high dielectric strength for demanding electronic applications.
Good thermal stability with glass transition temperature (Tg) of cured system typically exceeding 120°C.
Electrical encapsulation and potting compounds for transformers, reactors, and power modules.
High-voltage insulating coatings and busbar protection systems in energy infrastructure.
Structural adhesives for metal-to-metal and composite bonding in automotive and aerospace components.
Matrix resin for filament-wound pressure vessels and fiber-reinforced composites.
Printed circuit board (PCB) laminates and prepreg systems requiring low ionic impurities.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or suspended matter |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chloride Content | ≤ 800 ppm |
| Volatile Content | ≤ 0.3 wt% |
| Softening Point | 12–15°C |
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E-mail: wangxingqiang@ericwchem.com
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