High reactivity with amine and anhydride hardeners, enabling rapid cure at ambient or elevated temperatures.
Excellent electrical insulation properties, including high dielectric strength and low dissipation factor.
Superior chemical resistance to alkalis, solvents, and diluted acids after full cure.
Low viscosity (8,000–12,000 cP at 25 °C) for easy processing, impregnation, and void-free casting.
Good adhesion to metals, glass, and composite substrates without mandatory surface priming.
Electrical encapsulation of transformers, inductors, and high-voltage insulators.
Potting and coating of printed circuit boards (PCBs) and power electronics modules.
Structural bonding in aerospace and rail transportation components requiring flame retardancy.
Manufacturing of filament-wound composite pressure vessels and FRP piping systems.
| Chemical Type | Bisphenol-F based diglycidyl ether epoxy resin |
| Product Form | Clear, amber liquid |
| Appearance | Homogeneous, slightly viscous liquid, free from gels or sediment |
| Epoxy Equivalent Weight (EEW) | 170–185 g/eq |
| Viscosity (25 °C) | 8,000–12,000 cP |
| Color (Gardner) | ≤3 |
| Volatile Content (wt%) | <0.3% |
| Primary Applications | Encapsulation, potting, laminating, and structural composites |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China