High-purity bisphenol-A based liquid epoxy resin with low chloride content.
Excellent compatibility with common amine and anhydride curing agents.
Good thermal stability and low viscosity for easy processing and impregnation.
Superior electrical insulation properties suitable for high-reliability applications.
Consistent batch-to-batch performance meeting strict industrial quality control standards.
Electrical encapsulation and potting of transformers, reactors, and insulators.
High-voltage composite insulator matrix resin in power transmission systems.
Structural adhesives for aerospace and automotive bonding applications.
Prepregs and laminates for printed circuit board (PCB) base materials.
Coating formulations requiring chemical resistance and dielectric integrity.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, transparent liquid without sediment |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–16,000 cP |
| Chloride Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Key Features | Low volatility, high purity, excellent hydrolytic stability |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China