High epoxy equivalent weight (EEW) for controlled crosslink density and reduced exotherm during curing.
Excellent thermal stability and long-term dimensional stability in cured form.
Low volatility and minimal volatile organic compound (VOC) emissions during processing.
Superior compatibility with common amine, anhydride, and phenolic hardeners.
Consistent batch-to-batch performance due to stringent polymerization control and purification.
Electrical insulation systems for high-voltage transformers and bushings.
Structural adhesives requiring elevated heat resistance and mechanical integrity.
Encapsulation compounds for power electronics and LED modules.
Prepregs and laminates in printed circuit board (PCB) base materials.
High-performance composite matrices for aerospace and rail interior components.
| Chemical Type | Bisphenol-A based solid epoxy resin |
| Product Form | Pale yellow to off-white solid flakes or pellets |
| Appearance | Free-flowing, non-dusty granular solid |
| Epoxy Equivalent Weight (EEW) | 470–490 g/eq |
| Melting Point | 125–135 °C |
| Softening Point (Ring & Ball) | 85–92 °C |
| Color (Gardner Scale) | ≤ 3 |
| Volatile Matter (105 °C, 2 h) | ≤ 0.3 wt% |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China