High-performance thermoset epoxy adhesive system with excellent peel and shear strength.
Designed for structural bonding of composite and metal substrates in demanding aerospace environments.
Low outgassing profile compliant with ECSS-Q-ST-70-02C and NASA ASTM E595 requirements.
Excellent resistance to thermal cycling, humidity, and long-term aging at elevated temperatures.
One-component formulation with extended room-temperature shelf life and controlled pot life after thawing.
Aerospace primary and secondary structural bonding (e.g., wing skins, stiffeners, fairings).
Composite-to-composite bonding in satellite and launch vehicle assemblies.
Composite-to-aluminum or titanium bonding in high-reliability flight hardware.
Thermal interface bonding where dimensional stability under vacuum and temperature extremes is critical.
Ground support equipment requiring certified, low-outgassing structural adhesion.
| Chemical Type | Epoxy-based thermoset adhesive |
| Product Form | Pre-catalyzed film (1.0 mm nominal thickness) |
| Appearance | Uniform tan-colored flexible film |
| Primary Applications | Structural bonding in aerospace and space systems |
| Key Features | Low outgassing, high Tg (>170 °C), vacuum-compatible |
| Storage Condition | -40 °C to -20 °C; stable for 12 months when unopened |
| Cure Schedule (typical) | 120 °C for 90 min + 180 °C for 120 min under pressure |
| Compliance | Meets ASTM D1002, ECSS-Q-ST-70-02C, and Boeing BMS 8-263 Type I |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China