High-performance bisphenol-F type epoxy resin offering superior thermal stability and chemical resistance.
Low viscosity enables excellent processability in casting, impregnation, and coating applications.
Excellent electrical insulation properties with low dielectric loss at elevated frequencies.
Compatible with standard amine and anhydride curing agents for flexible formulation design.
Low chlorine content ensures enhanced reliability in high-reliability electronic encapsulation.
Encapsulation and potting of power electronics and IGBT modules.
Insulating coatings for motor windings and transformer components.
Structural adhesives requiring thermal and chemical durability.
High-voltage insulators and bushings in energy infrastructure.
Prepregs and laminates for specialty printed circuit boards (PCBs).
| Chemical Type | Bisphenol-F based epoxy resin |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, transparent liquid at 25°C |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 12,000–16,000 mPa·s |
| Chlorine Content | ≤ 700 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Electrical insulation, encapsulation, and high-performance composites |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China