Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

ADEKA EPU-133 Epoxy Resin

ADEKA EPU-133 is a high-performance epoxy resin from ADEKA’s EPU series, designed for demanding electronic encapsulation and underfill applications. It offers excellent thermal stability, low ionic impurity, superior adhesion to copper and silicon, and low moisture absorption—ideal for advanced semiconductor packaging and miniaturized electronics requiring reliability under harsh conditions.
  • adeka epu 133 epoxy resin_b0289a39
  • adeka epu 133 epoxy resin_b0289a39

Features Of ADEKA EPU-133 Epoxy Resin

  1. High-performance bisphenol-F type epoxy resin offering superior thermal stability and chemical resistance.

  2. Low viscosity enables excellent processability in casting, impregnation, and coating applications.

  3. Excellent electrical insulation properties with low dielectric loss at elevated frequencies.

  4. Compatible with standard amine and anhydride curing agents for flexible formulation design.

  5. Low chlorine content ensures enhanced reliability in high-reliability electronic encapsulation.

Typical Applications Of ADEKA EPU-133 Epoxy Resin

  1. Encapsulation and potting of power electronics and IGBT modules.

  2. Insulating coatings for motor windings and transformer components.

  3. Structural adhesives requiring thermal and chemical durability.

  4. High-voltage insulators and bushings in energy infrastructure.

  5. Prepregs and laminates for specialty printed circuit boards (PCBs).

Specifications Of ADEKA EPU-133 Epoxy Resin

Chemical TypeBisphenol-F based epoxy resin
Product FormClear to pale yellow liquid
AppearanceHomogeneous, transparent liquid at 25°C
Epoxy Equivalent Weight (EEW)185–195 g/eq
Viscosity (25°C)12,000–16,000 mPa·s
Chlorine Content≤ 700 ppm
Softening PointNot applicable (liquid at room temperature)
Primary ApplicationsElectrical insulation, encapsulation, and high-performance composites


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