High purity bisphenol A-based epoxy resin with consistent epoxide equivalent weight (EEW) for reliable reactivity control.
Excellent thermal stability and low volatility, supporting high-temperature curing processes without significant weight loss.
Low chloride content (< 500 ppm), minimizing corrosion risk in metal-coating and electronic encapsulation applications.
Optimized viscosity (12,000–16,000 cP at 25°C) for ease of handling, mixing, and processing in solvent-free or low-solvent systems.
Superior adhesion to metals, composites, and cured thermosets—enhancing performance in structural bonding and protective coatings.
High-performance protective coatings for offshore platforms, pipelines, and industrial steel structures.
Electrical insulation and potting compounds for transformers, circuit breakers, and high-voltage equipment.
Structural adhesive formulations used in aerospace composite assembly and automotive lightweight bonding.
Matrix resin for fiber-reinforced polymer (FRP) composites in wind turbine blades and pressure vessels.
Base resin for flame-retardant printed circuit board (PCB) laminates when combined with halogen-free flame retardants.
| Chemical Type | Bisphenol A diglycidyl ether (DGEBA) epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels and suspended matter |
| Epoxide Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–16,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | 12–15°C |
| Volatiles (150°C, 2 hrs) | ≤ 0.3 wt% |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China