High purity bisphenol A-based epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and long pot life for controlled processing in demanding applications.
Superior adhesion to metals, glass, and composite substrates under humid or elevated temperature conditions.
Low chlorine content (< 800 ppm), supporting compliance with RoHS and electronics-grade requirements.
Optimized viscosity (11,000–13,000 cP at 25 °C) for efficient impregnation and coating without excessive diluent use.
Electrical insulation systems for medium-voltage transformers and dry-type reactors.
Structural adhesives in aerospace and automotive composites requiring high Tg and dimensional stability.
Encapsulants and potting compounds for power electronics and LED modules.
High-performance laminates in printed circuit board (PCB) prepregs and copper-clad laminates.
Wind turbine blade bonding and structural reinforcement in fiber-reinforced polymer (FRP) systems.
| Chemical Type | Bisphenol A diglycidyl ether (DGEBA) |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free of gel particles or sediment |
| Epoxy Equivalent Weight (EEW) | 188–194 g/eq |
| Viscosity (25 °C) | 11,000–13,000 cP |
| Softening Point | 12–15 °C |
| Chlorine Content | ≤ 800 ppm |
| Color (Hazen/APHA) | ≤ 30 |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China