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High-performance bisphenol-A based liquid epoxy resin with low viscosity for excellent processability.
Superior thermal stability and glass transition temperature (Tg) after curing with standard amine hardeners.
Excellent adhesion to metals, composites, and cured polymer substrates.
Low volatile organic compound (VOC) content, supporting sustainable manufacturing compliance.
Consistent batch-to-batch reproducibility meeting ISO 9001-controlled production standards.
Aerospace composite matrix resins for primary and secondary structural components.
High-voltage electrical encapsulation and insulating potting compounds.
Wind turbine blade adhesive bonding and structural infusion systems.
Automotive under-hood structural adhesives and lightweight composite bonding.
Advanced printed circuit board (PCB) laminates requiring high dimensional stability.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Pale yellow to water-white, transparent |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–14,000 cP |
| Chlorine Content | ≤ 750 ppm |
| Softening Point | 10–14°C |
| Storage Stability | 12 months at ≤ 25°C in sealed containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
