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High-purity bisphenol-A based liquid epoxy resin with low chloride content.
Excellent compatibility with standard amine and anhydride curing agents.
Low viscosity enables easy handling, mixing, and processing in casting and impregnation applications.
Superior electrical insulation properties and thermal stability after curing.
Consistent batch-to-batch performance meeting stringent JIS K 6911 and ASTM D1656 specifications.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Impregnation of dry-type motor and generator windings.
Structural laminates for printed circuit board (PCB) substrates and prepregs.
Casting resins for medium-voltage switchgear components and bushings.
Adhesive formulations requiring high dielectric strength and moisture resistance.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, pale yellow liquid |
| Appearance | Transparent, slightly viscous liquid at 25°C |
| Epoxy Equivalent Weight (EEW) | 187–193 g/eq |
| Viscosity (25°C) | 12,000–15,000 mPa·s |
| Chloride Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Electrical insulation, casting, impregnation, laminates |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
