High reactivity with amine and anhydride hardeners, enabling rapid cure at ambient or elevated temperatures.
Excellent adhesion to metals, composites, and cured polymer substrates without surface priming.
Low viscosity (12,000–14,000 cP at 25 °C) for superior wetting and easy processing in casting, potting, and impregnation.
Outstanding electrical insulation properties with high dielectric strength (>18 kV/mm) and volume resistivity (>1×10¹³ Ω·cm).
Good thermal stability with glass transition temperature (Tg) of 125–135 °C after full cure with DDS hardener.
Electrical encapsulation and potting of high-voltage transformers and bushings.
Insulating coatings and impregnation resins for dry-type power transformers.
Structural bonding adhesives in wind turbine blade assembly and composite repair.
Casting compounds for medium-voltage switchgear components and insulators.
Matrix resin in filament-wound pressure vessels and aerospace secondary structures.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear, low-viscosity amber liquid |
| Appearance | Transparent to slightly yellow, homogeneous liquid |
| Epoxy Equivalent Weight (EEW) | 178–184 g/eq |
| Viscosity (25 °C) | 12,000–14,000 cP |
| Chloride Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | ≥ 12 months at <25 °C in sealed container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China