High-purity, low-chloride bisphenol-A based liquid epoxy resin with consistent reactivity.
Excellent adhesion to metals, composites, and cured thermosets for reliable bond integrity.
Low viscosity (12,000–14,000 cP at 25 °C) enabling easy processing, impregnation, and mixing.
Superior electrical insulation properties and high dielectric strength for electronic encapsulation.
Compatible with standard amine, anhydride, and phenolic curing agents for broad formulation flexibility.
Electrical encapsulation and potting of transformers, capacitors, and high-voltage components.
Structural adhesive formulations for aerospace and automotive composite bonding.
Matrix resin in filament-wound pressure vessels and fiber-reinforced polymer (FRP) tanks.
Coating systems for corrosion protection of steel infrastructure and marine equipment.
Tooling resins for precision molds and master models in composite manufacturing.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, amber-colored liquid |
| Appearance | Homogeneous, low-viscosity liquid |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25 °C) | 12,000–14,000 cP |
| Chloride Content | ≤ 750 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Encapsulation, structural adhesives, composites, protective coatings |
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E-mail: wangxingqiang@ericwchem.com
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