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High-purity bisphenol-A based liquid epoxy resin with low ionic chloride content.
Excellent compatibility with standard amine and anhydride curing agents.
Low viscosity at room temperature, enabling easy processing and improved wetting of substrates.
Superior electrical insulation properties and thermal stability after cure.
Consistent batch-to-batch performance meeting ISO 9001 manufacturing controls.
Electrical encapsulation for transformers, reactors, and high-voltage insulators.
Structural adhesives in automotive and aerospace composite bonding.
Matrix resin for filament-wound pressure vessels and FRP tanks.
Coating systems for corrosion-resistant linings in chemical process equipment.
Prepreg formulations for high-performance printed circuit board (PCB) laminates.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, transparent, free of sediment |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–14,500 mPa·s |
| Chloride Content | ≤ 750 ppm |
| Softening Point | 12–15°C |
| Storage Stability | 12 months at 25°C in sealed container |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
