High-purity bisphenol-A based solid epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low ionic impurity content for demanding electronic encapsulation.
Superior adhesion to metals, ceramics, and reinforced substrates without requiring surface priming.
Low melt viscosity enabling efficient processing via compression molding, transfer molding, and casting.
Outstanding electrical insulation properties and high dielectric strength after full cure.
Encapsulation and potting of semiconductor devices and integrated circuit modules.
Electrical insulators and high-voltage bushings in power transmission equipment.
Structural adhesives for aerospace composite bonding and metal-to-composite assemblies.
Thermoset matrices in filament-wound pressure vessels and cryogenic tank linings.
High-performance coatings for corrosion-resistant industrial flooring and chemical containment tanks.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) epoxy resin |
| Product Form | White to off-white crystalline solid flakes or pellets |
| Appearance | Free-flowing granular solid at room temperature |
| Epoxy Equivalent Weight (EEW) | 485–495 g/eq |
| Melt Viscosity (150 °C) | 12,000–15,000 cP |
| Glass Transition Temperature (Tg) | 55–62 °C (uncured) |
| Volatile Content | ≤ 0.3 wt% |
| Chlorine Content | ≤ 800 ppm |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China