Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DER 671 Solid Epoxy Resin

DowDER671SolidEpoxyResinisahigh-performancebrominatedbisphenol-AepoxyresinfromDow’sDERseriesofferingexcellentflameretardancy,electricalinsulation,andmechanicalstrengthforprintedcircuitboardsandadvancedcomposites.
  • dow der 671 solid epoxy resin_6864b754
  • dow der 671 solid epoxy resin_6864b754

Features Of Dow DER 671 Solid Epoxy Resin

  1. High-purity bisphenol-A based solid epoxy resin with consistent molecular weight distribution.

  2. Excellent thermal stability and low ionic impurity content for demanding electronic encapsulation.

  3. Superior adhesion to metals, ceramics, and reinforced substrates without requiring surface priming.

  4. Low melt viscosity enabling efficient processing via compression molding, transfer molding, and casting.

  5. Outstanding electrical insulation properties and high dielectric strength after full cure.

Typical Applications Of Dow DER 671 Solid Epoxy Resin

  1. Encapsulation and potting of semiconductor devices and integrated circuit modules.

  2. Electrical insulators and high-voltage bushings in power transmission equipment.

  3. Structural adhesives for aerospace composite bonding and metal-to-composite assemblies.

  4. Thermoset matrices in filament-wound pressure vessels and cryogenic tank linings.

  5. High-performance coatings for corrosion-resistant industrial flooring and chemical containment tanks.

Specifications Of Dow DER 671 Solid Epoxy Resin

Chemical TypeBisphenol-A diglycidyl ether (DGEBA) epoxy resin
Product FormWhite to off-white crystalline solid flakes or pellets
AppearanceFree-flowing granular solid at room temperature
Epoxy Equivalent Weight (EEW)485–495 g/eq
Melt Viscosity (150 °C)12,000–15,000 cP
Glass Transition Temperature (Tg)55–62 °C (uncured)
Volatile Content≤ 0.3 wt%
Chlorine Content≤ 800 ppm


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