Low-viscosity silicone formulation enables precise, void-free dispensing for fine-pitch die attach.
Fast room-temperature cure with optional thermal acceleration for high-throughput manufacturing.
Excellent thermal stability and long-term reliability under thermal cycling and humidity stress.
Non-corrosive, halogen-free chemistry compliant with RoHS and REACH requirements.
Strong adhesion to diverse substrates including silicon, copper, ceramic, and leadframe materials.
Power semiconductor packaging (e.g., IGBTs, MOSFETs, SiC and GaN devices).
LED chip-on-board (COB) and high-brightness LED module assembly.
Automotive electronics requiring AEC-Q200-compliant interconnect solutions.
Miniaturized sensor modules and MEMS device die bonding.
| Chemical Type | Platinum-cured addition-cure silicone |
| Product Form | Thixotropic paste, single-component |
| Appearance | Off-white to light gray, homogeneous paste |
| Primary Applications | Die attach for power electronics, LEDs, and sensors |
| Key Features | Low viscosity, rapid RT cure, halogen-free, non-corrosive |
| Benefits | Improved process yield, enhanced thermal reliability, compatibility with automated dispensing |
| Storage Conditions | Refrigerated at 2–8 °C; stable for 12 months unopened |
| RoHS Compliance | Yes (2015/863/EU) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China