High-solids, low-viscosity formulation enables excellent sprayability and uniform film formation.
Fast-drying solvent-based system provides rapid green strength development for high-speed production lines.
Outstanding heat resistance up to 120°C after full cure, maintaining bond integrity under thermal stress.
Excellent adhesion to low-energy substrates including polyolefins, PET, and metallized films.
EF (Enhanced Flow) grade optimized for edge-free coating and minimal overspray in automated application systems.
Flexible packaging lamination — especially for snack food, coffee, and frozen meal pouches.
Label facestock-to-liner bonding in pressure-sensitive label manufacturing.
Automotive interior trim assembly, including fabric-to-foam and vinyl-to-substrate bonding.
Medical device packaging requiring solvent-resistant, ISO 10993-compatible adhesive performance.
Industrial tape backing and transfer adhesive priming for high-performance double-coated tapes.
| Chemical Type | Acrylic copolymer with modified resin architecture |
| Product Form | Liquid, solvent-based solution |
| Appearance | Clear to slightly hazy amber liquid |
| Solvent System | Toluene/ethyl acetate blend (low aromatic content) |
| Solids Content | 48–52% w/w |
| Viscosity (Brookfield RV, 25°C, spindle #3, 20 rpm) | 1,800–2,400 cP |
| Density (25°C) | 0.92–0.95 g/cm³ |
| VOC Content | ≈490 g/L (as supplied) |
Q1: What is the primary function of THIXON OSN-2-EF in solvent-based adhesive formulations?
A: THIXON OSN-2-EF is a rheology modifier designed to provide controlled viscosity, sag resistance, and improved suspension of fillers or pigments in solvent-based adhesive systems—especially during application and early film formation.
Q2: Is THIXON OSN-2-EF compatible with common organic solvents used in industrial adhesives?
A: Yes—it is formulated for compatibility with a broad range of aliphatic and aromatic hydrocarbons, ketones, esters, and chlorinated solvents typically found in high-performance solvent-based adhesives.
Q3: How does THIXON OSN-2-EF perform under elevated temperature conditions during processing or storage?
A: It maintains stable rheological performance across typical industrial processing temperatures and shows good thermal stability in solvent-based systems up to approximately 80 °C, without significant loss of thickening efficiency or gelation risk.
Q4: Can THIXON OSN-2-EF be used in adhesives intended for flexible packaging laminates?
A: Yes—it is commonly selected for laminating adhesives where controlled open time, non-drip application, and uniform bond line thickness are critical, including certain flexible packaging applications requiring solvent-based chemistry.
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