Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL TC-4525 CV Thermally Conductive Gap Filler

Dow DOWSIL TC-4525 CV is a thermally conductive gap filler from the DOWSIL TC series offering low compression force high conformability and stable thermal performance up to 200°C ideal for EV battery modules power electronics and LED cooling applications.
  • dow dowsil tc 4525 cv thermally conductive gap filler_94abd2f6
  • dow dowsil tc 4525 cv thermally conductive gap filler_94abd2f6

Features Of Dow DOWSIL TC-4525 CV Thermally Conductive Gap Filler

  1. High thermal conductivity (2.5 W/m·K) for efficient heat dissipation in compact electronics.

  2. Low modulus and excellent compressibility enable reliable conformal contact under low assembly pressure.

  3. Room-temperature cure with optional heat acceleration—no mixing required, ready-to-use silicone elastomer.

  4. UL 94 V-0 rated for flame retardancy, supporting stringent safety compliance in power electronics.

  5. Non-slumping, tack-free surface after cure ensures clean handling and robust long-term interface stability.

Typical Applications Of Dow DOWSIL TC-4525 CV Thermally Conductive Gap Filler

  1. Electric vehicle (EV) battery modules and power inverters.

  2. Industrial LED lighting systems requiring high-power thermal management.

  3. 5G base station power amplifiers and RF heat sinks.

  4. Renewable energy inverters for solar and wind power conversion systems.

Specifications Of Dow DOWSIL TC-4525 CV Thermally Conductive Gap Filler

Chemical TypePlatinum-cured silicone elastomer
Product FormTwo-part, flowable paste (Part A + Part B)
AppearanceOff-white, uniform paste
Thermal Conductivity2.5 W/m·K (ASTM D5470)
Cure MechanismRoom temperature cure (7 days) or accelerated cure (1 hr @ 100°C)
Density2.3 g/cm³ (ASTM D792)
Hardness (Shore A)25–30 (ASTM D2240)
UL RecognitionUL 94 V-0 (per UL 746C)


Get in Touch with ERICW
Let competitive chemical materials go global.

Your Name *

Your Email *

Your Phone

Country

Your Message *