High thermal stability with glass transition temperature (Tg) exceeding 140 °C after full curing.
Excellent chemical resistance to acids, alkalis, and solvents in demanding industrial environments.
Low ionic impurity content, ensuring superior electrical insulation properties for electronic encapsulation.
Optimized molecular weight distribution for balanced processability and final mechanical performance.
Consistent batch-to-batch reproducibility meeting stringent ISO 9001 manufacturing controls.
Encapsulation and molding compounds for high-reliability semiconductor devices.
Underfill materials in flip-chip and advanced packaging applications.
Base resin for high-performance printed circuit board (PCB) laminates and prepregs.
Adhesives for aerospace structural bonding requiring elevated temperature resistance.
Electrical insulating varnishes and coil coatings in high-voltage equipment.
| Chemical Type | Cresol-formaldehyde novolac epoxy resin |
| Product Form | Off-white to light yellow solid pellets |
| Appearance | Free-flowing granular solid at room temperature |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Softening Point | 82–88 °C |
| Color (Gardner Scale) | ≤3 |
| Volatiles Content | ≤0.5 wt% |
| Chloride Content | ≤100 ppm |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China