Highly reactive bisphenol-F-based epoxy resin with low viscosity for excellent processability.
Superior thermal stability and glass transition temperature (Tg) after curing.
Low chloride content ensuring enhanced electrical insulation and corrosion resistance.
Excellent compatibility with standard amine and anhydride curing agents.
Consistent batch-to-batch performance meeting stringent ISO 9001 manufacturing controls.
Electrical encapsulation and potting of high-voltage transformers and insulators.
Advanced composite matrices for aerospace-grade carbon fiber laminates.
High-performance adhesives in automotive structural bonding applications.
UV-resistant protective coatings for offshore and marine infrastructure.
Dielectric substrates in printed circuit board (PCB) prepreg systems.
| Chemical Type | Bisphenol-F epoxy resin |
| Product Form | Liquid |
| Appearance | Clear to pale yellow, transparent liquid |
| Epoxy Equivalent Weight (EEW) | 178–186 g/eq |
| Viscosity at 25°C | 12,000–16,000 cP |
| Chloride Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤ 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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