High reactivity with amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.
Excellent adhesion to metals, composites, and cured polymer substrates without surface priming.
Low viscosity (8,000–12,000 cP at 25°C) enabling easy processing via casting, impregnation, and filament winding.
Superior electrical insulation properties with high dielectric strength (>18 kV/mm) and low dissipation factor.
Good chemical resistance to dilute acids, alkalis, and aliphatic solvents after full cure.
Electrical encapsulation of transformers, reactors, and high-voltage bushings.
Structural adhesive formulation for aerospace composite bonding and metal-to-composite joints.
Matrix resin in glass-fiber-reinforced laminates for printed circuit board (PCB) base materials.
Insulating coatings and potting compounds for power electronics and EV battery modules.
Tooling resins for precision molds used in carbon fiber component manufacturing.
| Chemical Type | Bisphenol-F based diglycidyl ether epoxy resin |
| Product Form | Liquid, clear amber to light brown |
| Appearance | Homogeneous, low-viscosity liquid, free from gels or particulates |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity (25°C) | 9,500–11,500 cP |
| Softening Point | Not applicable (liquid at room temperature) |
| Density (25°C) | 1.16–1.18 g/cm³ |
| Primary Applications | Electrical insulation, structural adhesives, composite matrix, potting & encapsulation |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China