Low viscosity for excellent flow and wetting in composite laminates and casting applications.
High purity with minimal gel particles and controlled volatile content for consistent processing.
Broad compatibility with standard amine and anhydride curing agents for flexible formulation design.
Good hydrolytic stability and shelf life when stored under recommended conditions (25°C, dry, sealed).
Low chlorine content (< 800 ppm) to support high electrical insulation performance in electronic encapsulation.
Electrical and electronic encapsulation, including potting compounds for sensors and power modules.
Structural composites in wind turbine blades and aerospace secondary structures.
High-performance adhesives for metal-to-metal and metal-to-composite bonding.
Castable systems for industrial flooring, countertops, and decorative resin art.
Prepreg matrix resin for carbon fiber and fiberglass reinforcement in automotive lightweighting.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow low-viscosity liquid |
| Appearance | Homogeneous, transparent, free of gels or sediment |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–15,000 mPa·s |
| Chlorine Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | ≥ 12 months at 20–25°C in original unopened container |
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E-mail: wangxingqiang@ericwchem.com
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