Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KUKDO KD-407 Epoxy Resin

KUKDO KD-407 Epoxy Resin is a high-performance liquid bisphenol-A epoxy resin from KUKDO’s KD series, offering excellent adhesion, chemical resistance and mechanical strength. Widely used in composites, coatings and electrical encapsulation, it delivers low viscosity, superior thermal stability and reliable curing compatibility with common hardeners.
  • kukdo kd 407 epoxy resin_4271dfa5
  • kukdo kd 407 epoxy resin_4271dfa5

Features Of KUKDO KD-407 Epoxy Resin

  1. High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.

  2. Excellent adhesion to metals, composites, and cured epoxy substrates without primer.

  3. Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing, impregnation, and air release.

  4. Good chemical resistance to alkalis, solvents, and diluted acids after full cure.

  5. Consistent batch-to-batch performance with strict quality control per ISO 9001 manufacturing standards.

Typical Applications Of KUKDO KD-407 Epoxy Resin

  1. Structural adhesive formulations for automotive and aerospace bonding.

  2. Matrix resin in fiber-reinforced composites for wind turbine blades and marine laminates.

  3. Electrical encapsulation and potting compounds for high-voltage insulators and power electronics.

  4. Coating systems for corrosion protection of steel infrastructure and offshore equipment.

  5. Tooling resins for low-temperature mold making and composite part replication.

Specifications Of KUKDO KD-407 Epoxy Resin

Chemical TypeDiglycidyl ether of bisphenol-A (DGEBA)
Product FormLiquid
AppearanceClear, pale yellow viscous liquid
Epoxy Equivalent Weight (EEW)185–195 g/eq
Viscosity (25°C)12,000–14,000 cP
Chlorine Content≤ 700 ppm
Softening PointNot applicable (liquid at room temperature)
Storage Stability12 months at ≤ 25°C in sealed containers


Get in Touch with ERICW
Let competitive chemical materials go global.

Your Name *

Your Email *

Your Phone

Country

Your Message *