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High molecular weight solid epoxy resin with excellent thermal stability and low melt viscosity.
Low chlorine content (< 900 ppm), supporting compliance with stringent electrical and electronic industry requirements.
Consistent batch-to-batch reproducibility for reliable performance in demanding manufacturing processes.
Excellent compatibility with common curing agents including anhydrides, dicyandiamide, and aromatic amines.
Superior mechanical strength and chemical resistance in cured thermoset formulations.
Electrical encapsulation and potting compounds for transformers, reactors, and power electronics.
High-voltage insulating coatings and busbar coatings in energy transmission equipment.
Structural adhesives requiring elevated temperature resistance and long-term durability.
Prepregs and laminates for printed circuit board (PCB) substrates and high-Tg multilayer boards.
Composite matrix resins for aerospace and industrial tooling applications.
| Chemical Type | Bisphenol-A based solid epoxy resin |
| Product Form | Pale yellow to amber solid flakes or pellets |
| Appearance | Free-flowing, uniform solid particles |
| Epoxy Equivalent Weight (EEW) | 875–925 g/eq |
| Melt Viscosity (at 175°C) | 8,000–12,000 cP |
| Gardner Color | ≤ 3 |
| Chlorine Content | ≤ 900 ppm |
| Softening Point | 88–94°C |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
