High crosslink density for exceptional chemical and solvent resistance.
Optimized flow and leveling characteristics for smooth, uniform film formation.
Excellent adhesion to steel, aluminum, and galvanized substrates without primer.
Low melt viscosity enabling efficient electrostatic application and reduced film defects.
Stable storage performance with minimal agglomeration under standard warehouse conditions.
Industrial appliance housings (e.g., refrigerators, washing machines).
Electrical enclosures and switchgear components.
Agricultural and construction equipment frames and panels.
Automotive under-hood components requiring thermal and corrosion resistance.
Office furniture metal parts and shelving systems.
| Chemical Type | Bisphenol-A based epoxy resin |
| Product Form | Free-flowing white to off-white powder |
| Appearance | Homogeneous fine granular powder |
| Primary Applications | Thermosetting powder coating binder |
| Key Features | High reactivity with dicyandiamide (DICY) hardeners |
| Benefits | Enables low-cure (180–190°C/15–20 min) formulations |
| Storage Stability | 12 months at ≤25°C in sealed original packaging |
| Recommended Hardener | DICY-based or phenolic co-curing agents |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China