Highly reactive bisphenol-A based liquid epoxy resin with excellent flow and wetting characteristics.
Low viscosity enables easy processing via casting, impregnation, and coating applications.
Superior adhesion to metals, glass, and composite substrates after proper curing.
Good chemical resistance to dilute acids, alkalis, and polar solvents in cured form.
Consistent molecular weight distribution ensures reproducible performance in formulation systems.
Electrical encapsulation and potting of transformers, sensors, and PCB modules.
Structural adhesive formulations for automotive and aerospace bonding.
Reinforced composite matrix resin for fiberglass and carbon fiber laminates.
Protective coatings for industrial flooring and corrosion-resistant linings.
Raw material for manufacturing high-performance epoxy molding compounds (EMCs).
| Chemical Type | Bisphenol-A Diglycidyl Ether (DGEBA) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Colorless to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–15,000 cP |
| Softening Point | Not applicable (liquid at room temperature) |
| Chlorine Content | ≤ 1,200 ppm |
| Volatiles Content | ≤ 0.3 wt% |
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E-mail: wangxingqiang@ericwchem.com
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