Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KUKDO SM-632 Epoxy Resin

KUKDO SM-632 is a high-performance bisphenol-A epoxy resin from the KUKDO SM Series offering excellent adhesion thermal stability and chemical resistance ideal for composites coatings and electrical encapsulation applications widely used in aerospace automotive and electronics industries.
  • kukdo sm 632 epoxy resin_bd84fa0b
  • kukdo sm 632 epoxy resin_bd84fa0b

Features Of KUKDO SM-632 Epoxy Resin

  1. High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.

  2. Excellent adhesion to metals, composites, and cured polymer substrates without surface priming.

  3. Low viscosity (12,000–14,000 cP at 25°C) enabling easy handling, degassing, and fiber impregnation.

  4. Superior thermal stability with glass transition temperature (Tg) up to 125°C after full cure.

  5. Low chloride content (< 500 ppm) ensuring high electrical insulation performance and corrosion resistance.

Typical Applications Of KUKDO SM-632 Epoxy Resin

  1. Electrical encapsulation and potting of transformers, reactors, and medium-voltage switchgear.

  2. Structural adhesive formulation for aerospace composite bonding and automotive lightweight assemblies.

  3. Matrix resin for filament-wound pressure vessels and carbon fiber reinforced pipes.

  4. High-performance casting compounds for industrial tooling and precision molds.

  5. Underfill and conformal coating materials in power electronics modules.

Specifications Of KUKDO SM-632 Epoxy Resin

Chemical TypeDiglycidyl ether of bisphenol-F (DGEBF)
Product FormClear, low-viscosity liquid
AppearanceAmber to pale yellow, transparent
Epoxy Equivalent Weight (EEW)178–184 g/eq
Viscosity (25°C)12,000–14,000 cP
Chloride Content< 500 ppm
Softening PointNot applicable (liquid at room temperature)
Storage Stability12 months at 20–25°C in sealed original container


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