High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured polymer substrates without surface priming.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy handling, degassing, and fiber impregnation.
Superior thermal stability with glass transition temperature (Tg) up to 125°C after full cure.
Low chloride content (< 500 ppm) ensuring high electrical insulation performance and corrosion resistance.
Electrical encapsulation and potting of transformers, reactors, and medium-voltage switchgear.
Structural adhesive formulation for aerospace composite bonding and automotive lightweight assemblies.
Matrix resin for filament-wound pressure vessels and carbon fiber reinforced pipes.
High-performance casting compounds for industrial tooling and precision molds.
Underfill and conformal coating materials in power electronics modules.
| Chemical Type | Diglycidyl ether of bisphenol-F (DGEBF) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Amber to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 178–184 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | < 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at 20–25°C in sealed original container |
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