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High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured polymer substrates without surface priming.
Low viscosity (1,200–1,600 mPa·s at 25°C) enabling easy processing by casting, impregnation, and filament winding.
Superior thermal stability with glass transition temperature (Tg) up to 180°C after full cure with DDS hardener.
Low chloride content (< 500 ppm), ensuring high electrical insulation performance and corrosion resistance in electronic encapsulation.
Electrical and electronic encapsulants for power modules, transformers, and LED housings.
Structural adhesive formulations for aerospace composite bonding and automotive lightweight assemblies.
Matrix resin for carbon fiber and glass fiber reinforced laminates in wind turbine blades and marine components.
High-performance potting compounds for industrial sensors and high-voltage insulators.
Casting resins for precision tooling, molds, and decorative art applications requiring dimensional stability.
| Chemical Type | Diglycidyl ether of bisphenol-A (DGEBA) |
| Product Form | Liquid, low-viscosity epoxy resin |
| Appearance | Clear, pale yellow to amber transparent liquid |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 1,200–1,600 mPa·s |
| Chloride Content | < 500 ppm |
| Softening Point | 12–18°C |
| Storage Stability | Stable for ≥12 months at 20–25°C in sealed containers |
Q1: What is the primary function of EM-0180 Epoxy Resin in coating and adhesive formulations?
A: EM-0180 serves as a reactive diluent and viscosity modifier, enhancing flow, improving substrate wetting, and contributing to crosslink density without significantly compromising thermal or chemical resistance.
Q2: Is EM-0180 compatible with standard amine and anhydride curing agents?
A: Yes, EM-0180 demonstrates broad compatibility with common aliphatic and aromatic amines, as well as cyclic anhydrides, enabling flexible formulation design across ambient- and elevated-temperature cure systems.
Q3: How does EM-0180 affect pot life and gel time in epoxy systems?
A: As a low-viscosity monofunctional epoxy, EM-0180 typically extends working time compared to higher-functionality resins, though the extent depends on cure chemistry and concentration—formulators should evaluate under actual processing conditions.
Q4: Can EM-0180 be used in high-solids or solvent-free applications?
A: Yes, its low volatility and reactivity make it suitable for high-solids coatings, powder coating modifiers, and 100% solids adhesives—contributing to reduced VOC content while maintaining processability.
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