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High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured polymer substrates without surface priming.
Low viscosity (1,200–1,600 mPa·s at 25°C) enabling easy processing by casting, impregnation, and filament winding.
Superior thermal stability with glass transition temperature (Tg) up to 180°C after full cure with DDS hardener.
Low chloride content (< 500 ppm), ensuring high electrical insulation performance and corrosion resistance in electronic encapsulation.
Electrical and electronic encapsulants for power modules, transformers, and LED housings.
Structural adhesive formulations for aerospace composite bonding and automotive lightweight assemblies.
Matrix resin for carbon fiber and glass fiber reinforced laminates in wind turbine blades and marine components.
High-performance potting compounds for industrial sensors and high-voltage insulators.
Casting resins for precision tooling, molds, and decorative art applications requiring dimensional stability.
| Chemical Type | Diglycidyl ether of bisphenol-A (DGEBA) |
| Product Form | Liquid, low-viscosity epoxy resin |
| Appearance | Clear, pale yellow to amber transparent liquid |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 1,200–1,600 mPa·s |
| Chloride Content | < 500 ppm |
| Softening Point | 12–18°C |
| Storage Stability | Stable for ≥12 months at 20–25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
