High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics without requiring aggressive surface priming.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing via casting, impregnation, and filament winding.
Superior electrical insulation properties with high dielectric strength (>18 kV/mm) and low dissipation factor.
Good thermal stability with glass transition temperature (Tg) of 125–135°C after post-cure.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Structural composite matrix resin for wind turbine blades and aerospace interior components.
Underfill and glob-top encapsulation in power semiconductor modules.
High-performance potting compound for industrial sensors and automotive control units.
Matrix binder in carbon fiber reinforced laminates for demanding mechanical applications.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear, amber-colored viscous liquid |
| Appearance | Transparent, slightly yellow, homogeneous liquid |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | ≤ 500 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | 12 months at ≤ 25°C in sealed original container |
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E-mail: wangxingqiang@ericwchem.com
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